The chip is bonded to a stress isolating mechanical structure and sealed into an evacuated package 采用了隔离垫片和应力隔离支柱来减小封装应力，完成了传感器的真空封装。
2.
Resonant pressure sensors are fabricated by ic process and mems technology and bonded to a stress isolating mechanical structure and sealed into an evacuated package 芯片利用半导体ic工艺和mems工艺制作，采用一种减小封装应力的结构，完成压力传感器的真空密封及封装。
